SoliDrop
Welcome, Guest Sign InSign Up

9/pcs 0.76/0.65/0.6/0.55/0.5/0.45/0.4/0.35/0.3Mm 9 Bottles/set Bga Solder Ball Leaded (25,000Pcs/bottle) For Bga Rework Repair

9/pcs 0.76/0.65/0.6/0.55/0.5/0.45/0.4/0.35/0.3Mm 9 Bottles/set Bga Solder Ball Leaded (25,000Pcs/bottle) For Bga Rework Repair
Price Tracker
Price Type
Price Desired
$
Your Email
Create aliexpress price watches
Price History
Product Details
  • Brand NameOem
  • Model Number0.3-0.76
  • TypeLeaded
  • UasageBga Reballing
  • Specification0.3,0.35,0.4,0.45,0.5,0.55,0.6,0.65.0.76Mm
Product Description
• 0.30mm leaded balls---1 bottle, 25K • 0.35mm leaded balls---1 bottle, 25K • 0.40mm leaded balls---1 bottle, 25K • 0.45mm leaded balls---1 bottle, 25K. • 0.5mm leaded balls---1 bottle, 25K • 0.55mm leaded balls---1 bottle, 25K • 0.6mm leaded balls---1 bottle, 25K. • 0.65mm leaded balls---1 bottle, 25K • 0.76mm leaded balls---1 bottle, 25K. BGA solder balls (BGA tin bead) is used instead of the pin in the IC component package structure to meet the interconnection of electrical and mechanical connection requires a connector terminal products for the digital camera / MP3/MP4 / Notebookcomputer / mobile communication devices (cell phones, high-frequency communications equipment) / LED / LCD / DVD / computer motherboard / PDA / car LCD TV / home theater (AC3 system) / satellite positioning systems and other consumer electronic products .BGA / CSP packagethe pieces of the development conforms to the trend of technological development and to meet the people of short, small electronic products, light, thin requirements, this is a high-density surface mount packaging technology, bga rework station, bga package, bga rework, BGA ball plantthe requirements are very high into a ball in the bottom of the package, the pins are arranged in a lattice-like pattern, thus named BGA. purity and sphericity of product characteristics: (solder balls) (lead-free solder beads)are very high, suitable for BGA, CSP and other state-of-the-art packaging technology and micro-welding, the minimum diameter of the solder ball 0.14mm, non-standard size can be customized according to customer requirements. use with automatic correction capability and allow relativelylarge placement error, unprovoked surface flatness problem.

Customer Reviews
Related Products